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Solderpaste - Surface Finish HALT Evaluation

An evaluation of PCB technology -  Single sided, double sided and Multilayer PCB use different dielectric materials and copper foils.  High speed circuitry requires dielectric space and line widths to be controlled.  In multilayer board the layer stack up must have balanced copper to prevent board warp.  Material stack-ups must be clearly defined to control electrical performance.  Total thickness of the finished PCB should approach 1.6 mm to enable use of industry standard connectors

 

 

RCC Stackup

 

 

 

 

 

 

6-Layer Options

 

 

 

Type-D

 

 
 
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