Confocal Microscopy – Collects and combines images from several focal planes to obtain full depth of field.  The Laser Scanning Microscope (SLM) provides a higher magnification and resolution than visible light optical microscopes. To obtain higher magnification and resolution the TLS has two Scanning Electron Microscopes (SEM)   Photoemission Analysis – Localization of failure sites by detection of the faint light emission caused by damage sites in silicon.       OBIC – Optical Beam Induced Current. The photon energy in the scanning laser produces current in the silicon circuit which can be imaged to indicate difference in circuit operation resulting from failed internal components.   Infrared laser scanning – The semiconductor silicon die is transparent to infrared; enabling “Flip-Chip” imaging to examine backside die metallization.   Instrumentation Details:   Zeiss LSM310 Confocal Laser Scan Microscope - Cooled CCD camera detects range of 400 nm (visible) to 1200 nm (infrared) - used for white light reflected microscopy and Photoemission Analysis. - Photo multiplier detector for 633 nm red laser – provides high resolution scanned images, has a confocal mode for layering images in the Z direction. - Germanium diode detector for Helium-Neon 1152 nm infrared laser to image through silicon.