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Material & Component Analysis
Material Engineering
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Component Analysis
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Component Testing

Semiconductor Electrostatic Discharge (ESD) Sensitivity Test:  Sensitivity of semiconductors to ESD type electrical overstress (EOS) pulses can be researched by applying varying voltages and current models to terminals of components.

 

 Component ESD Tester 300x225

Semiconductor ESD Sensitivity Test Equipment

 

Hermetic Evaluation:  The integrity of a component package is evaluated by immersing the device under test in a heated liquid Gross Leakage Test and observing bubbles; or, by immersing in a fluorescent dye (Zyglo) under a vacuum and observing the penetration.  In the photo below, the bright green area is where fluorescent dye (Zyglo) has penetrated into the component package and indicates an increased risk of ingress of contamination and resulting component failure. 

 

Zyglo Dye Penetration Test  

Post Zyglo Dye Penetration Test – UV Lighting

Glowing Green Area Indicates Dye Penetration

 

 
 
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