Thermal analysis measures physical properties of solid or liquid materials over time as temperature is varied.  These techniques are useful for characterizing materials, determining behavior under different temperature regimes and predicting physical and chemical changes with time or temperature.  Atmosphere can be altered to separate oxidation effects.  See TGA, DMA, TMA, DSC, and DPC for further information.

Thermo-Gravimetric Analysis (TGA) – Measures weight change with temperature.  This can be used to qualify operating temperatures for materials.  It can also be used for measuring moisture content, decomposition and to separate components which are released at various temperatures.  This is useful for fingerprinting combinations of ingredients and for separating components such as inorganic fillers in polymers.

Dynamic Mechanical Analysis (DMA) – Measures flexural properties over changes in temperature or stress rate.  Flexural modulus and loss as a function of temperature quantifies stiffness, damping, creep and other physical properties.  This technique is useful in identifying subtle differences between similar materials and for qualifying operating conditions.

Thermo-Mechanical Analysis (TMA) – Measures dimensional change with temperature.  This reveals thermal expansion magnitude and linearity.  It can also show softening points, melting points and other transitions.

Differential Scanning Calorimetry (DSC) – Measures heat flow as a function of temperature and time.  This provides information on physical and chemical changes such as melting points, glass transition, stress relaxation, crystallization, cure kinetics, heat capacity and thermal stability.

Differential Photocalorimetry (DPC) – Similar to DSC, but measures the effect of light on materials.  This supplies information on curing of adhesives and coatings by visible or UV light.