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Reliability
Packaging Testing
Reliability Test & Equipment
HALT Evaluation
Altitude Chamber
Dendrites
PCB and PCB Assembly Reliability
Solderability

Silver paste filled PCB through-holes is often used as a cost effective option for PTH metallization.  Our laboratory carries out migration tests to assure that the silver metallization and cover-coat soldermask processes used by your PCB supplier will provide sufficient coverage to prevent electro-migration of silver ions during humid operation. 

When a dendrite forms and bridges two conductors it results in an electrical short which can seriously degrade the performance of your product.  Following are photographs from a case study analysis of dendrite growth.

 

 

Scanning Electron Microscope view of dendrite growth from positive potential component lead to low potential via.

 

 

 

Optical microscope view of Dendrite growth

 

 

 

 

Growth study by power cycling

 
 
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