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Silver paste filled PCB through-holes is often used as a cost effective option for PTH metallization. Our laboratory carries out migration tests to assure that the silver metallization and cover-coat soldermask processes used by your PCB supplier will provide sufficient coverage to prevent electro-migration of silver ions during humid operation.
When a dendrite forms and bridges two conductors it results in an electrical short which can seriously degrade the performance of your product. Following are photographs from a case study analysis of dendrite growth.
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