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WETTING BALANCE – A wetting balance machine is used to establish minimum standards for solderability of component leads, terminals, wires and hardware by quantitatively measuring the degree and speed of wetting. This applies to tin, tin-lead and lead-free coated parts. An accelerated aging test is included to simulate natural aging in storage conditions.
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DIP TEST – This test describes a method also used to assess solderability by dipping in molten solder and examining the solder coating, sometimes called the dip and look test. This method may be used when the wetting balance is inappropriate, such as for very small terminations (chip components) or parts with a high thermal mass (thick metal hardware). |